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Chemical content 74HC4852PW

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Type numberPackagePackage descriptionTotal product weight
74HC4852PWSOT403-1TSSOP1653.52647 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352820891181512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1168577.900000.21830
PolymerAcrylic resinProprietary0.0228015.200000.04260
Resin systemProprietary0.010356.900000.01934
subTotal0.15000100.000000.28024
DieDoped siliconSilicon (Si)7440-21-30.89661100.000001.67507
subTotal0.89661100.000001.67507
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.8936397.4700037.16596
Iron (Fe)7439-89-60.489842.400000.91514
Phosphorus (P)7723-14-00.006120.030000.01144
Zinc (Zn)7440-66-60.020410.100000.03813
subTotal20.41000100.0000038.13067
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.35511
Silica fused60676-86-024.8149478.3300046.36014
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.61033
PigmentCarbon black1333-86-40.063360.200000.11837
PolymerEpoxy resin systemProprietary2.807488.862005.24503
Phenolic resinProprietary1.871655.908003.49669
subTotal31.68000100.0000059.18567
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00560
Nickel (Ni)7440-02-00.2910097.000000.54366
Palladium (Pd)7440-05-30.006002.000000.01121
subTotal0.30000100.000000.56047
WirePure metalCopper (Cu)7440-50-80.08987100.000000.16789
subTotal0.08987100.000000.16789
total53.52647100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.