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Chemical content 74LVC2G06GX

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Type numberPackagePackage descriptionTotal product weight
74LVC2G06GXSOT1255-2X2SON60.74986 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935307079147612601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04528100.000006.03806
subTotal0.04528100.000006.03806
ComponentAdditiveNon hazardousProprietary0.000255.000000.03334
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03334
Silica -amorphous-7631-86-90.0025050.000000.33340
PolymerEpoxy resin systemProprietary0.0015030.000000.20004
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06668
subTotal0.00500100.000000.66680
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.55069
Magnesium (Mg)7439-95-40.000440.150000.05801
Nickel (Ni)7440-02-00.008562.950001.14088
Silicon (Si)7440-21-30.001860.640000.24751
Pure metal layerGold (Au)7440-57-50.000060.020000.00773
Nickel (Ni)7440-02-00.004761.640000.63425
Palladium (Pd)7440-05-30.000260.090000.03481
subTotal0.29000100.0000038.67388
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21761
FillerSilica -amorphous-7631-86-90.001150.290000.15392
Silica fused60676-86-00.3428886.1500045.72547
HardenerPhenolic resinProprietary0.017074.290002.27699
PigmentCarbon black1333-86-40.000760.190000.10085
PolymerEpoxy resin systemProprietary0.034518.670004.60174
subTotal0.39800100.0000053.07658
WireGold alloyGold (Au)7440-57-50.0114699.000001.52862
Palladium (Pd)7440-05-30.000121.000000.01544
subTotal0.01158100.000001.54406
total0.74986100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.