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Chemical content LSF0101GX

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Type numberPackagePackage descriptionTotal product weight
LSF0101GXSOT1255-2X2SON60.74752 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690296147512601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03714100.000004.96838
subTotal0.03714100.000004.96838
ComponentAdditiveNon hazardousProprietary0.000255.000000.03344
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03344
Silica -amorphous-7631-86-90.0025050.000000.33444
PolymerEpoxy resin systemProprietary0.0015030.000000.20066
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06689
subTotal0.00500100.000000.66887
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100036.66511
Magnesium (Mg)7439-95-40.000440.150000.05819
Nickel (Ni)7440-02-00.008562.950001.14445
Silicon (Si)7440-21-30.001860.640000.24829
Pure metal layerGold (Au)7440-57-50.000060.020000.00776
Nickel (Ni)7440-02-00.004761.640000.63624
Palladium (Pd)7440-05-30.000260.090000.03492
subTotal0.29000100.0000038.79496
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.21830
FillerSilica -amorphous-7631-86-90.001150.290000.15440
Silica fused60676-86-00.3428886.1500045.86861
HardenerPhenolic resinProprietary0.017074.290002.28411
PigmentCarbon black1333-86-40.000760.190000.10116
PolymerEpoxy resin systemProprietary0.034518.670004.61614
subTotal0.39800100.0000053.24272
WireGold alloyGold (Au)7440-57-50.0172199.000002.30215
Palladium (Pd)7440-05-30.000171.000000.02325
subTotal0.01738100.000002.32540
total0.74752100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.